Phase-Lag-Based MPS/MPI Dual-Mode Precise In Vivo Temperature Imaging Technique

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Authors: Siao Lei, Wenxuan Zou, Yanjun Liu, Guanghui Li, Gen Shi, Jiaqian Li, Jie He, Guangxing Zhou, Jing Yang, Yu Yuan An, Jie Tian
Cited by: 2
References: 41

Abstract

Magnetic Particle Imaging (MPI) enables noninvasive temperature imaging without depth limitations. However, due to the lack of effective calibration strategies that can simultaneously address issues such as calibration infeasibility and environmental mismatch, its practical in vivo application remains challenging. In this work, we propose a novel in vivo temperature imaging method based on a dual-mode magnetic particle spectroscopy/magnetic particle imaging (MPS/MPI) system. First, MPS is employed to capture the differences in harmonic phase responses of magnetic nanoparticles (MNPs) under in vivo and in vitro conditions, thereby enabling the construction of calibration functions that are consistent with the in vivo environment. Second, an MLP based calibration strategy is proposed, which accounts for non-ideal deviations from the approximately linear temperature-phase relationship and integrates multi-parameter information into a unified network, thereby enabling accurate and stable temperature mapping. Comprehensive simulation, in vitro, and in vivo experiments demonstrate that, compared with conventional phantom-based temperature mapping methods, the proposed method reduces the in vivo temperature reconstruction error by approximately 17.24% and achieves an average absolute temperature error below $1.257~^{\circ } $ C. These results verify the feasibility of accurate in vivo temperature imaging using MPI and provide essential technical support for temperature-sensitive applications, including magnetic hyperthermia.

Fields of Study & Subjects

Ultrasound and Hyperthermia Applications Infrared Thermography in Medicine Photoacoustic and Ultrasonic Imaging

Publication details

Journal / source
IEEE Transactions on Medical Imaging
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
45
Issue
6
Pages
3216–3228
Publication date
5 March 2026
Language
EN