Deep Multi-View Clustering With Intra-View Similarity and Cross-View Correlation Learning

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Authors: Pengyuan Li, Dongxia Chang, Yiming Wang, Man Liu, Zisen Kong, Linhua Kong, Yao Zhao
Cited by: 4
References: 40

Abstract

Deep multi-view clustering (MVC) has gained widespread attention as it can effectively mine consistent information from multiple views and improve clustering performance. However, view bias often exists between views (i.e., the quality differences between views). Treating all views equally inevitably destroys structural information when simply concatenating or summing the embedded representation of multiple views. To alleviate this issue, we propose a deep multi-view clustering with intra-view similarity and cross-view correlation learning (MISCC), facilitating the intra-view discriminability and inter-view complementarity. Specifically, we utilize the intra-view inherent structure information to dynamically identify semantically similar samples within each view. By aggregating their embedding representations, fine-grained structures are enhanced to boost intra-cluster compactness and inter-cluster separation. Then, we construct a cross-view correlation learning module to align semantically related views while preserving the distinctive features of irrelevant views. Based on them, a centralized clustering alignment strategy is proposed to align the similarity distribution and clustering structure between each view and the unified view, balancing the diverse information among multiple views. By jointly training these modules, the unified representation is optimized to capture more discriminative information from multiple views. Extensive experiments conducted on eleven multi-view datasets demonstrate that MISCC outperforms the state-of-the-art clustering methods.

Fields of Study & Subjects

Domain Adaptation and Few-Shot Learning Face and Expression Recognition Face recognition and analysis

Publication details

Journal / source
IEEE Transactions on Multimedia
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
28
Pages
3682–3693
Publication date
1 January 2026