A 212–224 GHz, 32-Element, λ /2-Spaced Phased-Array Transmitter With Joint Subharmonic Mixer and IF Beamformer Presenting 36-dBm Peak EIRP
Abstract
This article presents a 220GHz, scalable planar phased array with precise$\lambda $/2 antenna spacing based on 0.13-$\mu $m SiGe BiCMOS technology. A novel joint design incorporating an image rejection subharmonic mixer (IRSHM) and a vector modulator (VM) is proposed based on the current reuse technique to effectively minimize power consumption and occupied area. And this architecture simultaneously enables image rejection, subharmonic up-conversion, and intermediate frequency (IF) phase and amplitude control. The proposed phased-array chip employs a splicing architecture with a$2\times 2$array and on-chip antenna, where a ninth harmonic generator, a local oscillator (LO) signal distribution network, and four highly integrated transmitters (TXs) are integrated. Through the chip-edge wire bonding, a$4\times 8$planar phased array is realized with an RF 3-dB bandwidth of 212–224GHz. In the measurement, the peak effective isotropic radiated power (EIRP) is 36dBm of a 32-element phased array at 221GHz, with about 2dBm output power per channel. A 3-dB beam widths of 10° (horizontal) and 17° (vertical), with beam steering capabilities of ±60° and ±40° in the respective planes are achieved. Furthermore, a wireless communication link using a 32-element phase array and a 40-dBi dish antenna is demonstrated, achieving data rates of 4 Gbps (QPSK) and 6 Gbps (16-QAM) with corresponding error vector magnitude (EVM) values of 9.5% and 9.2%, respectively. An inverse synthetic aperture radar (ISAR) imaging experiment involving two corner reflectors is also demonstrated. The measured azimuth resolution is 8mm, and two corner reflectors can be clearly distinguished.
Fields of Study & Subjects
Radio Frequency Integrated Circuit Design
Advanced Power Amplifier Design
Microwave Engineering and Waveguides
Publication details
- Journal / source
- IEEE Transactions on Microwave Theory and Techniques
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Volume
- 74
- Issue
- 5
- Pages
- 4380–4393
- Publication date
- 28 January 2026