Secure Data Sharing Framework With Fine-Grained Access Control and Privacy Protection for IoT Data Marketplace

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Authors: Woojin Jeon, Donghyun Yu, Ruei‐Hau Hsu, Jemin Lee
Cited by: 1
References: 30

Abstract

The proliferation of IoT devices has led to an exponential increase in data generation, creating new opportunities for data marketplaces. However, due to the security and privacy issues arising from the sensitive nature of IoT data, as well as the need for efficient management of vast amounts of IoT data, a robust solution is necessary. Therefore, this paper proposes a secure data sharing framework with fine-grained access control and privacy protection for the internet of things (IoT) data marketplace. For fine-grained access control of the data in the proposed protocol, we develop the hidden attributes and encryption outsourced key-policy attribute-based encryption (HAEO-KP-ABE) that outsources high-complex operations to peripheral devices with high capability to reduce the computation burden of IoT device. It achieves data privacy by hiding attributes in the ciphertext and by preventing entities that do not hold the data consumer’s secret key material (including SA/CS) from running the match test on stored ciphertexts before decryption. It also has an efficient match test algorithm which can verify that the hidden attributes of the ciphertext match the access policy of the data consumer’s private key without revealing those attributes. We demonstrate the proposed protocol satisfies the security features required for the data sharing process in an IoT data marketplace environment. Furthermore, we evaluate the execution time of the proposed protocol according to the number of attributes and show the practicality and efficiency of the proposed protocol compared to the related works.

Fields of Study & Subjects

Cryptography and Data Security Access Control and Trust Privacy-Preserving Technologies in Data

Publication details

Journal / source
IEEE Transactions on Network and Service Management
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
23
Pages
3311–3325
Publication date
1 January 2026