HEIoT: A Novel Three-Factor Authentication Protocol for Enhanced Security in IoT and Next-Generation Networks
Abstract
The Internet has a significant impact on contemporary society, enabling a wide range of applications, including advanced cellular networks such as 4G, 5G, and 6G. Since these communications occur over shared or open channels, ensuring secure data exchange is of critical importance, as any weakness in the communication infrastructure may compromise system reliability. Device authentication in the Internet of Things (IoT) and user authentication in smart environments, such as smart homes, remain fundamental security challenges. As the first line of defense, authentication mechanisms must be robust, since vulnerabilities at this stage can expose the entire system to serious threats. To address these challenges, numerous authentication schemes based on cryptographic primitives, including Elliptic Curve Cryptography (ECC), have been proposed. In this paper, we present a comprehensive security analysis of an ECC-based three-factor authentication protocol proposed by Yuan et al. Our analysis shows that the protocol is vulnerable to desynchronization, user impersonation, traceability, and insider attacks, all of which succeed with probability 1 by exploiting at most two protocol phases. To mitigate these weaknesses, we propose an improved authentication scheme, called HEIoT. The proposed scheme is formally analyzed under the Real-or-Random (RoR) model to establish session-key security and is further verified using the Scyther tool. Moreover, a Python-based implementation is provided to demonstrate the practicality of the proposed protocol. Comparative results indicate that HEIoT achieves stronger security while maintaining acceptable communication, computational, and storage overhead.
Fields of Study & Subjects
Advanced Authentication Protocols Security
IoT and Edge/Fog Computing
IPv6
Mobility
Handover
Networks
Security
Publication details
- Journal / source
- IEEE Transactions on Network and Service Management
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Volume
- 23
- Pages
- 6997–7006
- Publication date
- 1 January 2026