Decoupled Hierarchical Distillation for Multimodal Emotion Recognition

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Authors: Yong Li, Yuanzhi Wang, Yi Ding, Shiqing Zhang, Ke Lu, Cuntai Guan
Cited by: 2
References: 61

Abstract

Human multimodal emotion recognition (MER) seeks to infer human emotions by integrating information from language, visual, and acoustic modalities. Although existing MER approaches have achieved promising results, they still struggle with inherent multimodal heterogeneities and varying contributions from different modalities. To address these challenges, we propose a novel framework, Decoupled Hierarchical Multimodal Distillation (DHMD). DHMD decouples each modality's features into modality-irrelevant (homogeneous) and modality-exclusive (heterogeneous) components using a self-regression mechanism. The framework employs a two-stage knowledge distillation (KD) strategy: (1) coarse-grained KD via a Graph Distillation Unit (GD-Unit) in each decoupled feature space, where a dynamic graph facilitates adaptive distillation among modalities, and (2) fine-grained KD through a cross-modal dictionary matching mechanism, which aligns semantic granularities across modalities to produce more discriminative MER representations. This hierarchical distillation approach enables flexible knowledge transfer and effectively improves cross-modal feature alignment. Experimental results demonstrate that DHMD consistently outperforms state-of-the-art MER methods, achieving 1.3%/2.4% (ACC$_{7}$7), 1.3%/1.9% (ACC$_{2}$2) and 1.9%/1.8% (F1) relative improvement on CMU-MOSI/CMU-MOSEI dataset, respectively. Meanwhile, visualization results reveal that both the graph edges and dictionary activations in DHMD exhibit meaningful distribution patterns across modality-irrelevant/-exclusive feature spaces.

Fields of Study & Subjects

Emotion and Mood Recognition Sentiment Analysis and Opinion Mining Face and Expression Recognition

Publication details

Journal / source
IEEE Transactions on Pattern Analysis and Machine Intelligence
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
48
Issue
6
Pages
6912–6928
Publication date
3 February 2026
Language
EN