SMEStencil: Optimizing High-Order Stencils on ARM Multicore Using SME Unit

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Authors: Yinuo Wang, Tianqi Mao, Lin Gan, Wubing Wan, Zeyu Song, Jiayu Fu, Lanke He, Wenqiang Wang, Zekun Yin, Wei Xue, Guangwen Yang
Cited by: 0
References: 45

Abstract

Matrix-accelerated stencil computation is a hot research topic, yet its application to 3 dimensional (3D) high-order stencils and HPC remains underexplored. With the emergence of Scalable Matrix Extension(SME) on ARMv9-A CPU, we analyze SME-based accelerating strategies and tailor an optimal approach for 3D high-order stencils. We introduce algorithmic optimizations based on Scalable Vector Extension(SVE) and SME unit to address strided memory accesses, alignment conflicts, and redundant accesses. We propose memory optimizations to boost on-package memory efficiency, and a novel multi-thread parallelism paradigm to overcome data-sharing challenges caused by the absence of shared data caches. SMEStencil sustains consistently high hardware utilization across diverse stencil shapes and dimensions. Our DMA-based inter-NUMA communication further mitigates NUMA effects and MPI limitations in hybrid parallelism. Combining all the innovations, SMEStencil outperforms state-of-the-art libraries on Nividia A100 GPGPU by up to 2.1× . Moreover, the performance improvements enabled by our optimizations translate directly to real-world HPC applications and enable Reverse Time Migration(RTM) real-world applications to yield 1.8x speedup versus highly-optimized Nvidia A100 GPGPU version.

Fields of Study & Subjects

Parallel Computing and Optimization Techniques Embedded Systems Design Techniques Interconnection Networks and Systems

Publication details

Journal / source
IEEE Transactions on Parallel and Distributed Systems
Volume
37
Issue
3
Pages
651–665
Publication date
5 January 2026