Dynamic Electromagnetic-Thermo-Mechanical Coupling Analysis and Temperature Field Optimization in Duct-Bank Cable Clusters: A Multi-Physics Framework

IEEE Transactions on Power Delivery 2026

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Authors: He Zhu, Xun Wang, Sicheng Cheng, Jixin Guo, Sichuang Liu, Haoxian Wang

DOI: 10.1109/tpwrd.2026.3657164

Cited by: 1

References: 5

Fields of Study & Subjects

Thermal Analysis in Power Transmission Silicon Carbide Semiconductor Technologies Power Line Communications and Noise

References 5