Development and Practical Advances in Integrated Circuit Electromagnetic Reliability Over the Last Decade

As we delve deeper into the post-Moore era, integrated circuits (ICs) confront escalating electromagnetic reliability (EMR) challenges. Traditional electromagnetic compatibility (EMC) frameworks fall short in addressing the lifetime performance degradation of nano-scale ICs operating in multi-physics environments. This review offers a comprehensive synthesis of IC EMR advancements spanning the past decade (2013-2023), a period chosen because 28 nm to 3 nm scaling and the 2014/2020 revisions of AEC-Q100 and IEC 62132 introduced new degradation mechanisms not covered by earlier surveys. It establishes a consolidated framework of influencing factors, categorizing them into four interdependent domains: process scaling, GHz-band effects, 3D packaging, and application environments, thereby bridging critical literature gaps. The review also delves into emergent trends like multi-physics field modeling, automotive-grade AEC-Q100 compliance, and in-situ aging monitoring, proposing innovative data-driven solutions for pressing industry concerns. These solutions include standardized quantitative evaluation, chip-level electromagnetic interference (EMI) suppression, and lifetime prediction under harsh environmental conditions. The review culminates in presenting a forward-looking roadmap for next-generation EMR design, emphasizing AI-optimized shielding, self-healing circuits, and heterogeneous integration. These strategies are crucial for mitigating catastrophic system risks in safety-critical applications such as aerospace, automotive, and IoT.