SceneHub4D: A Dataset and Evaluation Framework for 6-DoF 4D VR Scenes

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Authors: Jaehong Kim, Tao Jin, Mallesham Dasari, Srinivasan Seshan, Anthony Rowe
Cited by: 1
References: 30

Abstract

Volumetric video and 6-DoF scene capture are becoming central to immersive applications such as telepresence and mixed reality content delivery. However, existing volumetric datasets are often short in duration, restricted to studio-captured human subjects, and provide only limited geometric representations. Consequently, evaluating real-world immersive applications in full-scene contexts often necessitates custom capture and 3D reconstruction setups, creating high practical barriers and ultimately hindering reproducibility. To this end, we present SceneHub4D, a new dataset and evaluation framework. Our dataset captures long, dynamic sequences across diverse real-world indoor environments with synchronized multi-view RGB-D streams, calibrated camera poses, and high-resolution background geometry reconstructed via photogrammetry and LiDAR. We provide multiple 3D representations, including point clouds, textured meshes, and Gaussian splats, along with a software toolkit for format conversion, rendering, and metric evaluation. To support structured comparison and perceptual analysis, we provide supplementary metrics including Geometry Complexity Score and Volumetric Temporal Information, and evaluate rendering performance across desktop GPUs and VR headsets. By lowering the practical barriers to capture, reconstruction, and evaluation, SceneHub4D enables researchers to study immersive 3D streaming and rendering systems without requiring custom hardware setups or complex data collection pipelines. We expect it will serve as a useful foundation for advancing volumetric media research.

Fields of Study & Subjects

Social Robot Interaction and HRI Multimodal Machine Learning Applications Robotics and Sensor-Based Localization

Publication details

Journal / source
IEEE Transactions on Visualization and Computer Graphics
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
32
Issue
5
Pages
4143–4153
Publication date
30 March 2026
Language
EN