A Physics-Informed Neural Network Surrogate for Runtime PDN and Dynamic Droop Prediction in 2.5-D Chiplet Integration
Fields of Study & Subjects
VLSI and FPGA Design Techniques
3D IC and TSV technologies
Interconnection Networks and Systems
Publication details
- Journal / source
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Volume
- 34
- Issue
- 4
- Pages
- 1075–1086
- Publication date
- 6 February 2026