A CIM Macro Embedded With Sign Operations for Parallel Signed Multibit Multiplication-and-Accumulation Using Hybrid Cell Array

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 2026

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Authors: Jin Zhang, Zhongzhen Tong, Qiang Zhao, Chunyu Peng, Wenjuan Lu, Jian Zhou, Xiaoxiao Chen, Zhiting Lin, Xiulong Wu
DOI: 10.1109/tvlsi.2026.3657208
Cited by: 1
References: 48

Fields of Study & Subjects

Interconnection Networks and Systems Low-power high-performance VLSI design Cryptography and Residue Arithmetic

Publication details

Journal / source
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Volume
34
Issue
3
Pages
904–917
Publication date
6 February 2026