TIDE-S: Telemetry Informed Delay Testing With Optimized Sensor Placement
Abstract
Silent data corruption (SDC) refers to undetected errors that yield incorrect results without triggering system alerts or error logs. Existing test methodologies are inadequate for capturing dynamic voltage fluctuations that occur under realistic workload conditions, thereby limiting their effectiveness for detecting SDCs. We present TIDE-S, a telemetry-informed delay testing (TIDE) framework that integrates presilicon sensor placement strategies to improve telemetry accuracy. By evaluating different sensor allocation schemes—uniform,$K$-means, and energy-aware clustering—TIDE-S improves the spatial granularity of voltage observation, enabling more accurate correlation between voltage fluctuations and path delay behavior. The combined telemetry- and sensor-aware methodology significantly improves the detection of timing-sensitive SDCs. The proposed framework incurs minimal infrastructure overhead by leveraging standard pad-based voltage observation, making it practical for real system-on-chip (SoC) designs. We demonstrate the effectiveness of TIDE-S across multiple RISC-V-based SoCs and a diverse set of real-world benchmarks, showing quantifiable improvements in voltage estimation, slack prediction, and test coverage.
Fields of Study & Subjects
VLSI and Analog Circuit Testing
Radiation Effects in Electronics
Low-power high-performance VLSI design
Publication details
- Journal / source
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- Volume
- 34
- Issue
- 4
- Pages
- 1369–1382
- Publication date
- 3 March 2026
- Language
- EN