Topological Semimetal MoP as Future Conductors in Back-End-of-Line: Thin Film Deposition, Resistivity Scaling, Processability, Integration, and Reliability

2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) 2026

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Authors: Keun Wook Shin, Hyangsook Lee, Changhyun Kim, Dae‐Jin Yang, Young Min Lee, Hyeong-Seok Jang, Yujin Han, Young-Chul Leem, Gi-Young Jo, Jeong Yub Lee, Kyung‐Eun Byun, Sang Won Kim
DOI: 10.1109/vlsitechnologyandcir65830.2026.11577445
Cited by: 1
References: 10

Fields of Study & Subjects

Semiconductor materials and interfaces MXene and MAX Phase Materials Transition Metal Oxide Nanomaterials

Publication details

Journal / source
2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
Publisher
IEEE
Pages
1–3
Publication date
14 June 2026