Fluid-Thermal Topology Optimization With Applications to Heat Sinks, Cooling Jackets, and Battery Cooling Plates

Abstract We present a new topology optimization method implemented in acusolve© software for the optimal design of devices in the presence of fluid flow and heat transfer. Topology optimization is used to determine the optimal design represented by a continuous design field that determines if a point is fluid or solid. Flow, thermal and other objectives and constraints are used to define the optimization problem, such as mechanical power losses, temperature difference from inlet to outlet, and the occupied fluid volume. The technology is based on solving the adjoint continuous thermal flow equations for the objectives and constraints to determine sensitivities that are used in the optimization framework. The final geometry is represented by a level set surface that may be used in subsequent analysis or the definition of the design of a part.