Conformal deposition of amorphous TiO x in high-aspect-ratio trenches by atmospheric-pressure mist chemical vapor deposition
Abstract
We demonstrate conformal deposition of amorphous TiOx films into high-aspect-ratio Si trenches by tubular furnace type atmospheric-pressure mist chemical vapor deposition (mist-CVD) using titanium diisopropoxide bis(acetylacetonate) [Ti(acac)2(OiPr)2] precursor dissolved in methanol solvent. Intermittent mist feeding, substrate positioning, and mesh electrode biasing yielded >90% step coverage in aspect ratio = 10–25 trenches at 200–300 °C. The resulting films were smooth (refractive index n ≈ 2.2 at 550 nm, RMS
Fields of Study & Subjects
Semiconductor materials and devices
Optical Coatings and Gratings
TiO2 Photocatalysis and Solar Cells
Publication details
- Journal / source
- Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
- Publisher
- American Vacuum Society
- Volume
- 44
- Issue
- 3
- Publication date
- 9 March 2026
- Language
- EN