4D microwave photonic co-packaging and optical computing with the low-power ultra-high-speed millimeter wave optoelectronic CMOS technology

3D Optical Co-Packaging integrates multiple chips within the same package. The chips are connected with guided photonic signals. This approach expands the functionalities of the microelectronics for more efficient parallel processing. Additional dimensions can be added, especially using the millimeter wave technologies, taking advantage of the properties of microwaves, which travel a long way with or without waveguides. 4D Microwave and Light Wave Co-Packaging stands for using microwaves and photonic signals in between multiple chips within the same package, taking advantage of the Microwave Photonic CMOS technology. Electronic signals are converted to microwave and optical signals, transmitted to other chips, and converted back to electronic signals