Wafer scale mechanical micro-machining of integrated optics in vacuum cells for quantum technologies
Abstract
We present high precision mechanical machining techniques which underpin developments in compact atom traps (5-25 mm width ≥ 6 mm wafer thickness) with integrated optical surfaces. Axial oscillation and 3D cross-feed grinding are proposed for generating optical surface quality with less than 20 nm Sa roughness. Abrasive waterjet is proposed for high throughput processing of lower tolerance surfaces. Our processes enable 3D optical access through transparent side walls or by mirrors, which can be arbitrarily orientated.
Fields of Study & Subjects
Advanced Surface Polishing Techniques
Laser Material Processing Techniques
Advanced Machining and Optimization Techniques
Publication details
- Journal / source
- Advanced Fabrication Technologies for Micro/Nano Optics and Photonics
- Pages
- 39–39
- Publication date
- 4 March 2026
- Language
- EN