Ultrahigh-speed laser drilling of transparent materials through transient excitation
Abstract
The use of glass substrates is promising in next-generation semiconductors, but their hardness and brittleness make processing extremely difficult. While etching methods are becoming mainstream, their complexity and environmental impact are concerns. Laser processing has emerged as a promising alternative, yet conventional methods require several tens of seconds to drill a single micro through-hole (depth >1 mm, diameter
Fields of Study & Subjects
Laser Material Processing Techniques
Laser-Matter Interactions and Applications
Glass properties and applications
Publication details
- Journal / source
- Laser-based Micro- and Nanoprocessing
- Pages
- 40–40
- Publication date
- 4 March 2026
- Language
- EN