Photonic wire bonds and facet-attached microlenses: enabling scalable integration of lasers and PICs

Components and Packaging for Laser Systems 2026

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Authors: Laura Elizabeth Horan, Sebastian T. Skacel

DOI: 10.1117/12.3077900

Cited by: 0

References: 5

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices Photonic and Optical Devices 3D IC and TSV technologies

References 5