Active alignment for co-packaged optics: an integrated solution to the alignment challenges of multichannel optical devices

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Authors: Justin L. Bressi, R. Ryan Vallance, Chris Heisler, Andrew Meek
Cited by: 0
References: 1

Abstract

The increasing demands of AI and high-performance computing necessitate a shift to co-packaged optics (CPO), which offers significant advancements in power efficiency and bandwidth. This presentation introduces a solution, codeveloped by Aerotech, Santec, and Senko, to one of the key challenges of CPO manufacturing, which is precise and rapid alignment of optical arrays. The solution combines the capabilities of the three companies, including precision motion control; optical signal generation and processing; and optical connector design and test to enable rapid optical array alignments. This synergistic platform ensures nano-scale alignment precision for minimizing signal loss during multichannel array coupling, addressing stringent CPO manufacturing tolerances and improving throughput for next-generation production.

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices Photonic and Optical Devices Optical Systems and Laser Technology

Publication details

Journal / source
Optical Interconnects and Packaging
Pages
2–2
Publication date
4 March 2026
Language
EN