Scalable self-aligned integration of microLEDs and III-N devices via fluidic and vdW assembly

Micro-LEDs are promising for next-generation displays due to their high brightness, energy efficiency, and ultra-fine resolution for microLED displays or AR/VR applications. However, assembling millions of microLED chips on large-area substrates with sub-micron precision and high throughput remains a critical bottleneck for manufacturing. This presentation offers a comprehensive overview of cutting-edge techniques for single-face alignment of micro-chip integration, utilizing van der Waals (vdW) force-assisted fluidic transfer mechanisms. These approaches enable the development of transparent micro-LED displays and heterogeneous optoelectronic integration platforms.