Development of bonding between copper and aluminum by blue diode laser induced multibeam laser metal deposition

2026

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Authors: Ritsuko Higashino, Yuji Sato, K. Takenaka, N. Abe, Masahiro Tsukamoto

DOI: 10.1117/12.3079014

Cited by: 0

References: 7

Fields of Study & Subjects

Additive Manufacturing Materials and Processes Welding Techniques and Residual Stresses Advanced Welding Techniques Analysis

References 7