Bonding interface analysis and thermal properties of Cr:LiSAF/sapphire composite chips

SPIE Solid State Lasers: Technology and Devices 2026

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Authors: Florent Cassouret, Yoichi Sato, Takunori Taira
DOI: 10.1117/12.3079507
Cited by: 0
References: 4

Fields of Study & Subjects

Solid State Laser Technologies Thermal properties of materials Silicon Carbide Semiconductor Technologies

Publication details

Journal / source
SPIE Solid State Lasers: Technology and Devices
Pages
17–17
Publication date
4 March 2026
Language
EN