High-density optical packaging of photodetectors and surface emitting optical sources from cryo to room-temperature for quantum, AI and aerospace applications

Optical Interconnects and Packaging 2026

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Authors: Jean-Luc Polleux, Benjamin Boisnard, Sema Ebrahimi, Zahraa Zaidan, Mathieu Versace, Carlos Viana
DOI: 10.1117/12.3080050
Cited by: 0
References: 7

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices Photonic and Optical Devices Advanced Semiconductor Detectors and Materials

Publication details

Journal / source
Optical Interconnects and Packaging
Pages
27–27
Publication date
4 March 2026
Language
EN