Subsurface interface modification in SiC by picosecond UV and deep-UV laser processing for electronic devices

Laser-based Micro- and Nanoprocessing 2026

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Authors: Mareike Schäfer, Yiyun Kang, Bastian Kaiser, Wolgang Bock, Anna Borysenko, R. Knappe, Johannes Albert L’huillier
DOI: 10.1117/12.3080513
Cited by: 0

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Laser Material Processing Techniques Semiconductor materials and devices

Publication details

Journal / source
Laser-based Micro- and Nanoprocessing
Pages
44–44
Publication date
4 March 2026
Language
EN