Enabling scalable co-packaged optics through high-precision glass structuring and photonic integration on panel-level substrates

This work presents the integration of laser-induced deep etching (LIDE®) and photonic assembly processes for scalable co-packaged optics (CPO) on thin glass substrates. LIDE® enables high-precision, damage-free structuring of glass, including through-glass vias (TGVs) and cavities, while Fraunhofer IZM’s platform supports ion-exchanged waveguides and passive alignment on large-area glass panels. The process integration combines electrical and optical interconnects within a single substrate, enabling chiplet-based photonic packaging. Experimental results include via placement accuracy and diameter deviation as well as cavity surface roughness, which is suitable for automated assembly. This joint development demonstrates the feasibility of a hybrid substrate platform for future high-bandwidth optical I/O in data center and HPC applications.