High-efficiency design methodology powered by machine-learning for fiber-to-chip coupling in co-packaged optics

Optical Interconnects and Packaging 2026

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Authors: Dekang Chen, Ahsan Ul Alam, Yalong Gu, Taylor Robertson, Angel Morales, Federico Duque Gomez, Duye Ye, Zhichao Zhang
DOI: 10.1117/12.3081138
Cited by: 0
References: 4

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices Photonic and Optical Devices Optical Network Technologies

Publication details

Journal / source
Optical Interconnects and Packaging
Pages
14–14
Publication date
4 March 2026
Language
EN