Automated process for soldering, assembly, and alignment of external cavity diode lasers

Optical Interconnects and Packaging 2026

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Authors: Joachim Sacher, Denis Erfle, Christian Aßmann, Sebastian Schmidtmann, Martin Honsberg
DOI: 10.1117/12.3081305
Cited by: 0
References: 8

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices Optical Systems and Laser Technology Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Optical Interconnects and Packaging
Pages
54–54
Publication date
4 March 2026
Language
EN