Reliability of heterogeneously integrated hybrid lasers for optical compute interconnects

Intel’s Silicon Photonics (SiPh) components including its hybrid-lasers have been proven to achieve good performance and reliability1, an important consideration for the reliable deployment of silicon photonics in optical compute interconnects (OCI) and co-packaged optics (CPO). In this paper, the impact of packaging-assembly-induced thermo-mechanical (TM) stress effects on the lasers during the packaging-assembly process is discussed. Particularly, a method to determine the thermal budget for packaging the lasers without impacting their reliability in the final products is proposed.