Challenges and opportunities of detachable metallic interconnects fiber-to-chip connectors for co-packaged optics in high-volume production

Optical Interconnects and Packaging 2026

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Authors: Heng Loong Lee, Andrew Meek, Naoki Oe, R. Ryan Vallance, Yang Chen, Richard Pitwon, Kazu Takano
DOI: 10.1117/12.3082553
Cited by: 0
References: 10

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices 3D IC and TSV technologies Optical Network Technologies

Publication details

Journal / source
Optical Interconnects and Packaging
Pages
20–20
Publication date
4 March 2026
Language
EN