Fiber-to-fiber and fiber-to-chip connections for high-density optical I/O: an automated multiphysics optimization framework

Optical Interconnects and Packaging 2026

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Authors: S. Dahiya, N. Kaur, N. Dhingra, A. Morales
DOI: 10.1117/12.3082833
Cited by: 0
References: 2

Fields of Study & Subjects

Semiconductor Lasers and Optical Devices Photonic and Optical Devices Optical Network Technologies

Publication details

Journal / source
Optical Interconnects and Packaging
Pages
44–44
Publication date
4 March 2026
Language
EN