Thermal-aware design and simulation of copackaged electronic-photonic integrated circuits

Components and Packaging for Laser Systems 2026

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Authors: Lihong Heidi Jiao, Fedor G. Pikus

DOI: 10.1117/12.3083573

Cited by: 0

References: 15

Fields of Study & Subjects

Photonic and Optical Devices Semiconductor Lasers and Optical Devices 3D IC and TSV technologies

References 15