Halide vapor phase epitaxy of thick GaN and InGaN using GaClx and InClx

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Authors: Hisashi Murakami, Akinori Koukitu
Cited by: 0

Abstract

Our group has conducted thermodynamic analyses of GaN and InGaN growth using various group-III precursors to achieve rapid, thick GaN and InGaN layer growth. From a thermodynamic perspective, tri-halide vapor phase epitaxy (THVPE), employing metal trichlorides like InCl3 and GaCl3, is ideal for growing ultra thick GaN and InGaN alloys. This method offers excellent compositional control, high growth rates, prevents droplet formation, and results in low impurity concentrations for InGaN growth. In this presentation, we will show the impact of various growth parameters, including growth temperature, input partial pressures of group-III precursors, and the V/III ratio.

Fields of Study & Subjects

GaN-based semiconductor devices and materials Silicon Carbide Semiconductor Technologies solar cell performance optimization

Publication details

Journal / source
Gallium Nitride Materials and Devices
Pages
1–1
Publication date
5 March 2026
Language
EN