The path to scalability for integrated photonic modules

The combination of photonic and electronic circuitry in photonic modules enables complex microsystems with greatly enhanced capabilities that open numerous market opportunities from sensing in health and agriculture to Optical Interconnects for next generation supercomputers. A robust and flexible supply chain from design and proof of concept to scalable production is essential to serve the various markets. We will review packaging approaches optimizing optical, electrical and thermal interfaces for key applications. We will review the capabilities and scalability for hybrid and heterogeneous integration as well as 3D stacking each address unique applications.