Electro-optic integration for next generation optical networks

Optical communication demand is accelerating with AI, cloud, and HPC, driving unprecedented growth in datacenter interconnect (DCI) traffic. Differentiation now hinges on devices, packaging, and integration spanning pluggables (beyond 800G), co‑packaged optics (CPO), DSP, and advanced cooling. We present recent innovations in analog front‑end (AFE) devices and their integration that enable next‑generation coherent systems targeting single‑wavelength capacities > 3 Tb/s at extreme symbol rates (> 260 GBd). Results include broadband TFLN travelling wave Mach-Zehnder modulators with reduced Vπ, high speed BiCMOS and InP drivers, and their co‑design and co-integration.