Inspection and metrology of micro-bumps and hybrid copper bonding using high-resolution 3D x-ray imaging

Metrology, Inspection, and Process Control XL 2026

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Authors: Till Dreier, Daniel Nilsson, Julius Hållstedt
DOI: 10.1117/12.3090618
Cited by: 2

Fields of Study & Subjects

3D IC and TSV technologies Nanofabrication and Lithography Techniques Copper Interconnects and Reliability

Publication details

Journal / source
Metrology, Inspection, and Process Control XL
Publisher
SPIE
Pages
99–99
Publication date
20 February 2026