Impact of dry developing process on patterning performance of inorganic-organic hybrid thin films for all-dry EUV resist application

Advances in Patterning Materials and Processes XLIII 2026

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Authors: Thi Thu Huong Chu, Dan Nguyen Linh Le, suyoung yoo, Doo San Kim, Minjong Lee, Dushyant M. Narayan, Won-Il Lee, Nikhil M. Tiwale, Jean-François Veyan, Chang-Yong Nam, Jiyoung Kim
DOI: 10.1117/12.3090806
Cited by: 1

Fields of Study & Subjects

Copper Interconnects and Reliability Advancements in Photolithography Techniques Fluid Dynamics and Thin Films

Publication details

Journal / source
Advances in Patterning Materials and Processes XLIII
Publisher
SPIE
Pages
104–104
Publication date
20 February 2026