Ultrafast laser fabrication of low-taper angle through glass vias on glass core substrates

2026

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Authors: Jason R. Grenier, Daniel W. Levesque, Nicholas J. Smith, Alvin W. Mao, Omkar D. Supekar, Robert A. Schaut

DOI: 10.1117/12.3091230

Cited by: 0

Fields of Study & Subjects

Laser Material Processing Techniques Glass properties and applications 3D IC and TSV technologies