Research on the estimation of thermoelastic physical parameters based on a GNN-PINN hybrid model

This paper proposes a GNN-PINN hybrid model for estimating thermoelastic parameters in BGA and QFN packaging structures, enabling quantitative analysis of solder fatigue in electronic devices. For BGA packaging, the PCBA is simplified as a non-homogeneous elastic plate, and the hybrid model captures micro-mechanical behavior at material interfaces under multi-scale, multi-field conditions. For QFN packaging, a layered graph network with direction-sensitive message passing and principal stress constraints is developed to extract directional equivalent parameters. Simulations reveal that QFN structures experience notable deformation under thermal cycling, particularly at high temperatures.