Numerical analysis of condensation risk in electronic equipment enclosures based on COMSOL

When electronic equipment operates in high-temperature and high-humidity environments, condensation can lead to critical component failures, causing severe issues such as short circuits and corrosion. This study establishes a numerical simulation model for coupled heat and moisture transfer inside electronic equipment using the COMSOL Multiphysics platform. By incorporating typical meteorological data from Hainan, China, the research systematically investigates the evolution of condensation risk under transient environmental conditions. The study assumes an initially uniform water vapor concentration inside and outside the enclosure, neglecting diffusion effects, and focuses on the dynamic coupling characteristics of temperature, humidity, and flow fields. Numerical results indicate that the top portion of the enclosure presents the greatest condensation potential because of its comparatively lower temperature than surrounding areas. The introduction of slit structures significantly improves internal flow field distribution, thereby reducing condensation risk. This research provides a theoretical foundation for moisture-proof design in electronic equipment deployed in hightemperature and high-humidity regions.