Enhancing corrosion resistance of Sn–Ag–Cu lead-free solders through Cu-induced Cu6Sns phase formation

The European Physical Journal Plus 2026

View at publisher
Authors: Tehmina Bashir, Irfan Liaquat, A.B. Ziya, Abdul Munam Khan
DOI: 10.1140/epjp/s13360-026-07318-z
Cited by: 0
References: 67

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Corrosion Behavior and Inhibition Electrodeposition and Electroless Coatings

Publication details

Journal / source
The European Physical Journal Plus
Volume
141
Issue
2
Publication date
7 February 2026
Language
EN