Collagen-derived electronic skins: from biomimetic principles to multifunctional sensing and applications

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Authors: Mengtao Zhao, Yuchong Ren, Yixiang Mao, Wanhong Wu, Xiaoyao Tan, Ling Bai, Yan Xu, Hao Yuan, Yanxia Wei, Guiqiang He, Aixia Lu, Jie Yu
+3 more Zhongxue Bai, Mengchen Huang, Jian Zhou
Cited by: 1
References: 207

Abstract

Electronic skin (e-skin) holds significant potential for applications in health monitoring and human-machine interaction. However, conventional materials are often limited by poor biocompatibility and mechanical mismatch with biological tissues. Collagen and its derivatives, as naturally derived biopolymers, have emerged as an ideal matrix for constructing high-performance e-skin due to their exceptional biocompatibility, tunable biodegradability, mechanical properties that closely match human skin, and bioactivity endowed by abundant cell-recognition motifs. This review systematically presents the biomimetic design principles and advanced fabrication strategies of collagen-derived e-skins (CDE-Skins), including structural biomimicry, diversified manufacturing techniques, and conductive functionalization. It further examines their performance and underlying mechanisms in multimodal sensing, such as tactile, thermal, humidity, and biochemical sensing, elucidating the origins of their high sensitivity and stable signal response. The article also highlights representative applications in personalized telehealth monitoring, wound protection and therapy, and human-machine teleoperation. Concurrently, it outlines current challenges and offers perspectives on future research directions. This work aims to provide a comprehensive theoretical foundation to advance technological innovation and accelerate the practical translation of biocompatible e-skin technologies.

Fields of Study & Subjects

Advanced Sensor and Energy Harvesting Materials Collagen: Extraction and Characterization Hydrogels: synthesis properties applications

Publication details

Journal / source
Collagen and Leather
Publisher
Springer Science and Business Media LLC
Volume
8
Issue
1
Publication date
2 June 2026
Language
EN