Comparative study on thermal analysis of CPU square profile fins by analysing the effects of different materials

In today's changing world of technology, the use of computers has seen an increase, in recent times and is expected to keep growing steadily in the coming years thanks to digitalization and technological progress. The performance, operation and lifespan of a CPUs components heavily depend on the temperature at which the junction operates. Pin fins are extensions designed to cool computer chips by improving heat dissipation through convection. This study conducts analysis on fin designs to identify an appropriate fin shape with optimal spacing for effective cooling of computer chips. The research utilized Autodesk Fusion 360 software for design, modelling, and simulation purposes. The main fin shape considered was square plate fin. Factors such as fin shape, thickness 3mm fin height and fin material were varied in the study. Three materials, Aluminium alloy 6061 copper and zinc were chosen for assessing fin properties. Ultimately Aluminium alloy 6061 was identified as the material for the fins due to its heat dissipation capabilities.