Thermal ANSYS analysis on CPU cylindrical fins by analysing the influence of different materials

The use of computers has increased significantly over the past few years and is expected to continue to do so at a very good rate in the years to come in the context of the current scenario, which is marked by rapid technological advancement, digitalization, and advancement. The junction's operating temperature has a significant impact on how well and long-lasting the electric parts of a CPU (Central Processing Unit) work. Fins are extended surfaces with the primary motivation behind cooling microprocessors by expanding the intensity scattering rate by means of convection. In order to determine a suitable fin geometry with sufficient spacing to effectively cool computer chips, this research paper uses thermal analysis of various fin types. Autodesk Fusion 360 is the software that was used to design, model, and simulate in the current research paper. There are primary fin geometries that have been taken into consideration: the circular plate. The varying boundaries for this situation are the blade shape, balance thickness (2.5mm, 3mm, and 4mm) balance level and balance material. Three materials Aluminium alloy 6061, copper and zinc have been considered for the investigation of the blade qualities. However, due to its maximum heat dissipation rate, aluminium alloy 6061 was found to be the best material for the fins.