Laser Flash Diffusivity Measurements of Filled Adhesive Effective Thermal Conductivity and Contact Resistance Using Multilayer Methods
Abstract
Thermal modeling of electronics packages requires accurate thermophysical property data for package materials. The ability to accurately predict the device junction temperature has become critical due to the increasing power and speed and decreasing size of semiconductor devices. Accurate data for the thermal resistance of the adhesive bondlines used in electronics packaging is critical because this thermal resistance can be a significant part of the total thermal resistance in the heat flow paths from the device junction to the package case or ambient.
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Thermal properties of materials
Heat Transfer and Numerical Methods
Publication details
- Journal / source
- CRC Press eBooks
- Pages
- 191–202
- Publication date
- 2 February 2026
- Language
- EN
- Document type
- Book chapter