Concurrent process design of transfer molding for electronic packages using process simulation and design of experiments method

Transfer molding is used extensively in electronic packaging. Production rate and molding quality heavily rely on epoxy resin characteristics, encapsulation mold design and setting of process parameters of transfer molding. Traditionally, the mold design and making are done first and then the process parameters are determined after a number of molding trial-runs. This would result in long process development time for satisfactory molding quality. In this paper, combining process simulation and Design of Experiments (DOE) approach to the concurrent process design of transfer molding for electronic packages is described. Process simulation is conducted first according to a full factorial experimental design. The simulation results are then analyzed to gain the understanding about the effect of the process and mold design parameters on the quality of molded packages. Hence, the proper setting of the process and mold design parameters can be determined concurrently.