Numerical analysis of thermally cycled Ball Grid Array solder joints

CRC Press eBooks 2026 Book chapter

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Authors: C. Yan, Q.H. Qin, Yiu‐Wing Mai

DOI: 10.1201/9781003762454-13

Cited by: 0

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Heat Transfer and Numerical Methods Welding Techniques and Residual Stresses