Parametric analysis and optimization for Flip Chip package

This paper focus on the methodology of parametric influences analysis and optimization for the VonMises equivalent residual stress induced in major packaging process of the Flip Chip microelectronic assembly. Based on the results of a 3D Finite Element Method ( FEM ) simulation loops for the packaging process, a Response Surface analysis by using the technique of Central Composite Design Sampling ( CCDS ) is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built. Probabilistic analysis as well as parametric sensitivities study is also implemented on the ground of a random Monte Carlo Simulation results. Finally, the better solution of the chief packaging parameters is obtained from a global parametric optimization strategy of the Genetic Algorithm.