Graphene-Encased Hybrid Semiconductor Chip with Multi-Layered InGaAs/ GaAs and Vertically Integrated Memory for Enhanced Thermal Management and Data Processing using Quantum Dots v1. Research Background Detailed Problem Statement
Fields of Study & Subjects
Thermal properties of materials
Semiconductor Quantum Structures and Devices
GaN-based semiconductor devices and materials
Publication details
- Publication date
- 1 January 2026
- Language
- EN